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Printed Circuit Assembly Flow-Soldering Flux

Printed Circuit Assembly Flow-Soldering Flux

Product Category :    Soldering Flux

Supplier                :    Khanna Traders & Engineers

Key Features of Printed Circuit Assembly Flow-Soldering Flux

  • A mixture of high quality WW resin and alcohol, having solid content between 30-40%. Used where flux residue removal is not necessary or where the circuit is affected by low level current leakage
  • Mainly used for wire and component lead tinning
  • Delivers non-corrosive residue


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Product Profile of Printed Circuit Assembly Flow-Soldering Flux

Printed Circuit Assembly Flow-Soldering Flux is a mixture of high quality WW resin and alcohol having solid content between 30-40%. The Flow-Soldering Flux is used where flux residue removal is not necessary or where the circuit is affected by low level current leakage. The Flow-Soldering Flux is mainly used for wire and component lead tinning. Printed Circuit Assembly Flow-Soldering Flux delivers non-corrosive residue and can be custom made in various grades as per specific requirements.

Key Features of Printed Circuit Assembly Flow-Soldering Flux
  • A mixture of high quality WW resin and alcohol, having solid content between 30-40%. Used where flux residue removal is not necessary or where the circuit is affected by low level current leakage
  • Mainly used for wire and component lead tinning
  • Delivers non-corrosive residue
  • Can be custom made in various grades as per specific requirements
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